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Informática
PCB Surface |
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HASL (hot air solder leveling)/HASL lead Free |
HASL/HASL lead free is the process of coating tin-lead/ tin-lead free solder on the surface of PCB so that it forms a layer of both anti-copper oxidation and good weld ability of the coating. |
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Organic Coating (OSP) |
OSP is a chemical process to build a layer of organic skin film on the clean bare copper surface, it helps anti-oxidation,and moisture resistance, to protect the copper surface from vulcanization or oxidation, etc. In simply words,OSP acts as a barrier between copper and air. |
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ENIG (Electroless Nickel/Immersion Gold) |
ENIG is a thick nickel gold alloy with good electrical properties on the copper surface,acts as a rust barrier to protect PCB for a long time, which can be useful and achieve excellent electrical performance in the long term use of PCB. |
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Immersion Silver |
Silver impregnation does not put heavy coat on PCB, which provides good electrical properties and maintains good solder ability when exposed to humidity ,heat,and pollution, |
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Immersion Tin |
With adding organic additives to the tin layer, the tin layer structure is granular, which overcomes the tin whisker problems and has excellent thermal stability and solder ability. |
As one of contract electronics manufacturing companies, we will do our best to meet all the needs of customers.
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Esta página es acerca de los importadores y exportadores de PCB Surface Buscar en la categoria : Informática Buscar en la categoria : surface |
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