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Materias primeras
HY-9055 Electronic Potting Compound |
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Model |
Color |
Viscosity (cps) |
Hardness (A°) |
Mixing ratio |
Operating Time(min) |
Curing Time(hr, 25℃) |
|
HY-9055 |
White |
3000±500 |
55±5 |
1: 1 |
30~60 |
4~5 |
(Pls note: the above data for this product in 25 ℃ temperature, 55 percent humidity conditions, for reference. The accurate data is measured by customers when using.)
TECHNICAL GUIDELINES
1, Typical Application
HY-9055 could be applied to
- high powered electronics,
- DC/DC module and circuit board which requires heat dissipation and high temperature resistance.
-It can be broadly used for LED screen, Wind Power Generator, PCB substrate, etc. Pls put part A and part B in separate container and stir evenly before mixing the two part together.
2, Mixing Ratio: part A: part B = 1: 1
3, Deaeration the mixture in vacuum pump under 0.08 MPa for 3-5 minutes.Then the mixture could be used for pouring.
4, Pls note that the thickness of the silicone affects the curing time. If the silicone used is a little thick,then the curing time will be a little longer.The temperature also affects the curing time.When in lower temperature, we suggest customers appropriately heat the mixture to accelerate vulcanization. With temperature of 80~100℃, the silicone will cure in 15 minutes; while in 25℃ room temperature, the silicone will cure around 8 hours.
Notes:
1.The following material may hinder the curing of HY-9055, so pls use after the test. When necessary, pls clean the application areas.
Buen trato: comprar del vendedor
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