HY-9055 Electronic Potting Compound

HY-9055 Electronic Potting Compound

Description

HY-9055 is a kind of low viscosity, Inherent flame resistance, two components addtion cured potting silicone with heat-conducting. It cures with both on room temperature and heated temperature. It has the feature of the higher temperature the faster of the curing time.

Application

HY-9055 is suitable for bonded seal of electronic components, power module and control module, LED invertor potting, etc which requires waterproof and insulation. It can be broadly used for LED screen, Wind Power Generator, PCB, substrate, etc.

Technical Parameters

(Pls note: the above data for this product in 25 ℃ temperature, 55 percent humidity conditions, for reference. The accurate data is measured by customers when using.)

TECHNICAL GUIDELINES

1, Typical Application

HY-9055 could be applied to

- high powered electronics,

- DC/DC module and circuit board which requires heat dissipation and high temperature resistance.

-It can be broadly used for LED screen, Wind Power Generator, PCB substrate, etc. Pls put part A and part B in separate container and stir evenly before mixing the two part together.

2, Mixing Ratio: part A: part B = 1: 1

3, Deaeration the mixture in vacuum pump under 0.08 MPa for 3-5 minutes.Then the mixture could be used for pouring.

4, Pls note that the thickness of the silicone affects the curing time. If the silicone used is a little thick,then the curing time will be a little longer.The temperature also affects the curing time.When in lower temperature, we suggest customers appropriately heat the mixture to accelerate vulcanization. With temperature of 80～100℃, the silicone will cure in 15 minutes; while in 25℃ room temperature, the silicone will cure around 8 hours.

Notes:
1.The following material may hinder the curing of HY-9055, so pls use after the test. When necessary, pls clean the application areas.