TAIYO - 103 Anuncios

Miércoles 31 mayo 2023

Precio : 100USD

Number of layers: 4 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 6/3.5mil Inner layer W/S: 6/4mil Thickness: 0.8mm Min. hole diameter: 0.28mm Special process: impedance control+half hole Advantages Of 4 Layer ENIG Impedance Control Half Hole Fr4 PCB Own lamination process...

Miércoles 31 mayo 2023

Precio : 100USD

Number of layers: 2 Surface finish: OSP Base material: FR4 Outer Layer W/S: 6/4mil Thickness: 1.0mm Min. hole diameter: 0.25mm Special process: impedance control+half hole Advantages Of 2 Layer OSP Impedance Control Half Hole PCB Own lamination process to convenient production for...

Miércoles 31 mayo 2023

Precio : 100USD

Number of layers: 2 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 7/4mil Thickness: 1.0mm Min. hole diameter: 0.3mm Special process: impedance control+half hole Advantages Of 2 Layer ENIG Impedance Control Half Hole PCB Product Own lamination process to convenient production...

Miércoles 31 mayo 2023

Precio : 100USD

Number of layers: 2 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 8.5/3.5mil Thickness: 0.8mm Min. hole diameter: 0.2mm Special process: half hole Advantages Of Two Sided PCB Own lamination process to convenient production for Multilayer PCB and shorten the lead time. Jiangxi...

Sábado 29 abril 2023

Cantidad : 0 PCS-1000 - Precio : 1 USD/set ~ 300 USD/

PCB Capability GreensTone has successfully served customers with PCB manufacturing service in communication, industial devices, new engrgy, power supply, sensors, smart home applications control, smart industial control , medical devices and security control device and so on. GreensTone...

Martes 11 abril 2023

Number of layers: 4 Surface finish: ENIG Base material: High TG FR4 Outer Layer W/S: 4/3.5mil Inner layer W/S: 4/3.5mil Thickness: 1.0mm Min. hole diameter: 0.25mm Special process: Impedance Control Advantages Of 4 Layer High TG Impedance Control Fine Pitch PCB Own lamination process...

Martes 11 abril 2023

Number of layers: 4 size：80*88mm Surface finish: ENIG Base material: Rogers FR4 4350B Min. hole diameter: 0.3mm Minimum Line Width：0.230mm Minimum Line Space：0.170mm Thickness: 1.0mm Advantages Of 4 Layer Rogers FR4 PCB Own lamination process to convenient production for Multilayer...

Martes 11 abril 2023

Number of layers: 2 Surface finish: ENIG Base material: Taconic TLY-5A Min. hole diameter: 0.3mm Outer Layer W: 1.046mil Outer layer S: /mil Thickness: 0.94mm Advantages Of 2 Layer Taconic PCB Own lamination process to convenient production for Multilayer pcb product and shorten the lead time...

Martes 11 abril 2023

Number of layers: 2 size: 184.2*158.9mm Surface finish: LF-HASL Base material: Rogers 4350B Min. hole diameter: 0.4mm Minimum Line Width: 0.227mm Minimum Line Space: 0.127mm Thickness: 0.7mm Advantages Of 2 Layer Rogers LF-HASL PCB Own lamination process to convenient production for...

Martes 11 abril 2023

Number of layers: 2 size: 96.45*87.73mm Surface finish: ENIG Base material: Rogers 4350B Min. hole diameter: 0.5mm Minimum Line Width：/mm Minimum Line Space：0.139mm Thickness: 0.35mm Advantages Of 2 Layer Rogers ENIG RF Circuit Board Own lamination process to convenient production...

Martes 11 abril 2023

Number of layers: 2 size: 98.45*49.45mm Surface finish: ENIG Base material: Rogers 4350B Min. hole diameter: 0.5mm Minimum Line Width：/mm Minimum Line Space：0.139mm Thickness: 0.35mm Advantages Of 2 Layer Rogers PCB Own lamination process to convenient production for Multilayer PCB...

Martes 11 abril 2023

Number of layers: 2 Surface finish: ENIG Base material: F4B Min. hole diameter: 0.8mm Outer Layer W: 6mil Outer layer S: 6mil Thickness: 1.0mm Advantages Of 2 Layer F4B PCB Own lamination process to convenient production for Multilayer PCB and shorten the lead time. Jiangxi facility...

Miércoles 08 febrero 2023

Number of layers: 6 Surface finish: HASL Base material: FR4 Outer Layer W/S: 9/4mil Inner layer W/S: 11/7mil Thickness: 1.6mm Min. hole diameter: 0.3mm Special process: Blind Vias Advantages Of 6 Layer HASL Blind Buried Via PCB Own lamination process to convenient production for...

Miércoles 08 febrero 2023

Number of layers: 14 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/5mil Inner layer W/S: 4/3.5mil Thickness: 1.6mm Min. hole diameter: 0.2mm Special process: Blind & Buried Vias Advantages Of 14 Layer PCB Own lamination process to convenient production for Multilayer...

Miércoles 08 febrero 2023

Number of layers: 12 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 7/4mil Inner layer W/S: 5/4mil Thickness: 1.5mm Min. hole diameter: 0.25mm Special process: Blind Vias Advantages Of 12 Layer PCB Own lamination process to convenient production for Multilayer PCB and shorten...

Miércoles 08 febrero 2023

Number of layers: 10 Surface finish: ENIG Base material: FR4 W/S: 4/4mil Thickness: 1.6mm Min. hole diameter: 0.2mm Special process: Blind Vias Advantages Of 10 Layer ENIG Blind Vias PCB Own lamination process to convenient production for Multilayer PCB and shorten the lead time....

Martes 13 diciembre 2022

Precio : 100USD

Fast PCB Prototyping Service 97% On-Time Delivery Ratio In accordance with IPC standards, high quality PCB prototype manufacturer strictly control the qualified rate of finished products. Prototype PCB board manufacturer implement PDCA process to continuously improve quality and...

Martes 13 diciembre 2022

Precio : 100USD

Number of layers: 8 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/3mil Inner layer W/S: 4/3mil Thickness: 1.2mm Min. hole diameter: 0.2mm Special process: impedance control Advantages Of 8 Layer ENIG Impedance Control PCB Own lamination process to convenient production...

Viernes 21 octubre 2022

Precio : 10-30USD

Number of layers: 4 Surface finish: ENIG Base material: High TG FR4 Outer Layer W/S: 4/3.5mil Inner layer W/S: 4/3.5mil Thickness: 1.0mm Min. hole diameter: 0.25mm Special process: Impedance Control Advantages Of 4 Layer High TG Impedance Control Fine Pitch PCB Own lamination process...

Viernes 21 octubre 2022

Precio : 10-30USD

Number of layers: rogers fr4 size：80*88mm Surface finish: ENIG Base material: FR4+Rogers 4350B Min. hole diameter: 0.3mm Minimum Line Width：0.230mm Minimum Line Space：0.170mm Thickness: 1.0mm Advantages Of 4 Layer rogers fr4 pcb Own lamination process to convenient production for...

Viernes 21 octubre 2022

Precio : 10-30USD

Number of layers: 2 Surface finish: ENIG Base material: Taconic TLY-5A Min. hole diameter: 0.3mm Outer Layer W: 1.046mil Outer layer S: /mil Thickness: 0.94mm Advantages Of 2 Layer Taconic PCB Own lamination process to convenient production for Multilayer PCB and shorten the lead time...

Viernes 21 octubre 2022

Precio : 10-30USD

Number of layers: 2 size: 184.2*158.9mm Surface finish: LF-HASL Base material: Rogers 4350B Min. hole diameter: 0.4mm Minimum Line Width: 0.227mm Minimum Line Space: 0.127mm Thickness: 0.7mm Advantages Of 2 Layer Rogers LF-HASL PCB Own lamination process to convenient production for...

Viernes 21 octubre 2022

Precio : 10-30USD

Number of layers: 2 size: 96.45*87.73mm Surface finish: ENIG Base material: Rogers 4350B Min. hole diameter: 0.5mm Minimum Line Width：/mm Minimum Line Space：0.139mm Thickness: 0.35mm Advantages Of 2 Layer Rogers ENIG Rf PCB Own lamination process to convenient production for Multilayer...

Viernes 21 octubre 2022

Precio : 10-30USD

Number of layers: 2 size: 98.45*49.45mm Surface finish: ENIG Base material: Rogers 4350B Min. hole diameter: 0.5mm Minimum Line Width：/mm Minimum Line Space：0.139mm Thickness: 0.35mm Advantages Of 2 Layer Rogers PCB Own lamination process to convenient production for Multilayer PCB...

Viernes 21 octubre 2022

Precio : 10-30USD

Number of layers: 2 Surface finish: ENIG Base material: F4B Min. hole diameter: 0.8mm Outer Layer W: 6mil Outer layer S: 6mil Thickness: 1.0mm Advantages Of 2 Layer F4B PCB Own lamination process to convenient production for Multilayer PCB and shorten the lead time. Jiangxi facility...

Viernes 02 septiembre 2022

Number of layers: 16 Surface finish: ENIG Base material: FR4 Thickness: 3.0mm Min. hole diameter: 0.35mm size：420×560mm Outer Layer W/S: 4/3mil Inner layer W/S: 5/4mil Aspect Ratio: 9: 1 Special process: via-in-pad Impedance Control Press Fit Hole Advantages Of 16 Layer ENIG Press...

Viernes 02 septiembre 2022

Number of layers: 10 Surface finish: ENIG Aspect Ratio: 8: 1 Base material: FR4 Outer Layer W/S: 4/4mil Inner layer W/S: 5/3.5mil Thickness: 2.0mm Min. hole diameter: 0.25mm Special process: Impedance Control, Resin Plugging, Different Copper Thickness Advantages Of 10 Layer Impedance...

Sábado 02 julio 2022

97% On-Time Delivery Ratio In accordance with IPC standards, high quality pcb prototype manufacturer strictly control the qualified rate of finished products. Prototype pcb board manufacturer implement PDCA process to continuously improve quality and prototype board pcb custom order performance...

Sábado 02 julio 2022

Number of layers: 8 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/3mil Inner layer W/S: 4/3mil Thickness: 1.2mm Min. hole diameter: 0.2mm Special process: impedance control Advantages Of 8 Layer PCB ENIG Impedance Control PCB Own lamination process to convenient production...

Martes 17 mayo 2022

Number of layers: 8 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/3.5mil Inner layer W/S: 4/3.5mil Thickness: 1.2mm Min. hole diameter: 0.2mm Special process: impedance control+half hole Advantages Of 8 Layer ENIG Impedance Control Half Hole PCB Own lamination process...