Vendedor Lynngui

Lynngui 
  • 3/5
Detalle
Perfil Evaluacion : 3/5
Cantidad de evaluaciones : 0

Vendedor dado de alta desde el 17 junio 2016
Lugar donde se encuentra el vendedor : Baoan

China 518101 Materias primeras
Offer Thermal Tape

Sábado 20 abril 2024

Thermal Tape/gap filler/thermally conductive tape: High temperature resistance High thermally conductive Self adhesive Thermal Solution: thermal pad, gap filler, gap pad, thermal putty, thermal gel, thermal grease, phase change materials, EMI absorption thermal interface materials...

Goldlink Tongda Electronics Co., Ltd

  • 518101 - Baoan
  • 86 755 27579310
China 518101 Materias primeras
Offer Graphene Thermal Sheet

Viernes 19 abril 2024

Graphene Thermal Sheet: High thermal performance Small size, light weight Thermal solution: thermal pad, gap filler, gap pad, thermal putty, thermal gel, thermal grease, phase change materials, EMI absorption thermal interface materials and silicone free types, etc. Ubicación ...

Goldlink Tongda Electronics Co., Ltd

  • 518101 - Baoan
  • 86 755 27579310
China 518101 Materias primeras
Offer Electrostatic Discharge Thermal Pad

Sábado 13 abril 2024

Electrostatic Discharge Thermal Pad: Electrostatic discharge Comformable Designed for mid-stress applications Electrically isolating Thermal solution business includes thermal pad, gap filler, gap pad, thermal putty, thermal gel, thermal grease, EMI absorption thermal interface...

Goldlink Tongda Electronics Co., Ltd

  • 518101 - Baoan
  • 86 755 27579310
China 518101 Vehiculos
Offer Thermal Pads for Electrical Vehicle battery

Sábado 23 julio 2016

Thermal pad/ thermal gap filler pad: Designed for Electrical Vehicle Battery Thermal Management System. Low density Ultra conformable Low stress application Fiberglass reinforced Ubicación : Rm616,619, Huafeng Xianan Building, Block45, Baoan, Shenzhen, China, 518101 Baoan, Persona...

Goldlink Tongda Electronics Co., Ltd

  • 518101 - Baoan
  • 86 755 27579310
China 518101 Materias primeras
Offer Stressless Thermal Putty Gel

Sábado 23 julio 2016

Thermal Interface Materials including thermal pad, gap filler, gap pad, thermal putty, thermal Gel, EMI absorption thermal materials. Thermal Putty Gel/thermal gap filler: For UAV design and northbridge IC Excellent compressibility Low thermal resistance Good creep performance Ubicación ...

Goldlink Tongda Electronics Co., Ltd

  • 518101 - Baoan
  • 86 755 27579310