Ceramic metalization
| Description : | 1.high precision, good electrical and thermal properties, high bonding strength of. 2.good weldability, blind hole through hole can be realized 3.mature technology, environmental protection, pollution-free, cost is lower than traditional technology. 4.a wide range of applications, single-sided, double-sided three-dimensional ceramic circuit board can be produced. 5.customized production, without mold opening, short production cycle. |
| Features : | 1.high precision, good electrical and thermal properties, high bonding strength of. 2.good weldability, blind hole through hole can be realized 3.mature technology, environmental protection, pollution-free, cost is lower than traditional technology. 4.a wide range of applications, single-sided, double-sided three-dimensional ceramic circuit board can be produced. 5.customized production, without mold opening, short production cycle. |
Persona a contactar : Guotao Yu, +18 1 86 12 99 34
Buen trato: comprar del vendedor
Por favor, lea nuestras condiciones de uso. También puede visitar nuestras preguntas frecuentes y ver nuestra información sobre los riesgos relacionados con la falsificación.
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Esta página es acerca de los importadores y exportadores de Ceramic metalization Buscar en la categoria : Informática Buscar en la categoria : ceramic, metalization |
Materias primerasReportar abuso
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Cantidad : 1800 kg - Precio : 75 EUR (Negotiable)
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