Materias primeras

Copper alloy materials

1. Copper, copper alloy and special cooper alloy foil Specification: 50kgs/Rollx 110mm (Width ) x 0.03 mm~0.15mm (Thickness) Technical parameter: 1). Thermal conductivity: ≥ 500Wm-1k-1; 2). Electrical conductivity: ≥ 85%IACS~100%IACS; 3). Tensile strength: ≥ 400MPa~700MPa; 4). Soften temperature: ≥300℃ . At the same time, it has high corrosion-proof and high arc extermination ability. Applicable fields: It is mainly used for Identification, bank card, commercial card and IC card etc. Supply ability: 700MT/Year
Ubicación : No. A-2-3, Block A, Bldg. 1, High-tech Park, Tianfu Road, Chengdu, China, 610041 Chengdu,
Persona a contactar : Hui Fu, +86 28 66070577

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Copper alloy materials

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