Dicing Blades Without Hub
Cantidad : 5000-40,00 Precio : USD10-USD2,000/pc
The wafer dicing blade without hub is a kind of ultra-thin and precision diamond dicing blades with excellent cutting ability, good rigidity, and high efficiency. It fits to be used for dicing and slitting of many materials, such as semiconductors, electronic components, ceramics, etc.
Performance of Dicing Blades Without Hub
Strong cutting ability
High accuracy
The thinnest wheel is 0.015mm, thickness tolerance is ±0.002mm
Applications of ultra thin diamond blade Without Hub
For dicing BGA, Alumina, TiC, Ferrite, LTCC, and other materials.
E grind, as an excellent diamond wheel manufacturer, offers a wide range of resin bonded grinding wheels for you to choose from.
Persona a contactar : wheel egrind, 0371 68616868
Buen trato: comprar del vendedor
Por favor, lea nuestras condiciones de uso. También puede visitar nuestras preguntas frecuentes y ver nuestra información sobre los riesgos relacionados con la falsificación.
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