EMMC test socket, burn-in socket,11.5x13_0.5mm, for BGA 153 and BGA 169 testing, eMMC...
1. Apply to eMMC of Samsung, Sandisk, Toshiba, Hynix, Micron, HTC, MTK and Intel.
2. Apply to BGA 169 and BGA 153 testing.
3. eMMC data could be read and written fastly.
4. With 30 pins and pin pictch 0.5mm.
5. eMMC size of this product is 11.5x13mm, we also provide other sizes of
12x16mm
14x18mm
12x18mm.
6. Apply to eMMC thickness of 0.8mm and 1.5mm.
7. Accurate positioning on flat bottom pad and solder of eMMC.
8. Life cycle is around 25,000 times.
9. Support flat bottom and solder ball testing.
we're the original manufacturer !!!We have the lowest prices!The shortest processing time guaranteed!!!
Persona a contactar : Samuel Lee, +8618926505183
Buen trato: comprar del vendedor
Por favor, lea nuestras condiciones de uso. También puede visitar nuestras preguntas frecuentes y ver nuestra información sobre los riesgos relacionados con la falsificación.
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Esta página es acerca de los importadores y exportadores de EMMC test socket, burn-in socket,11.5x13_0.5mm, for BGA 153 and BGA 169 testing, eMMC... Buscar en la categoria : Bienes de equipo Buscar en la categoria : 5x13_0, socket, emmc, test, burn, testing |
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