Tienda de KENLINGPCBA Kenling Electronics Co. Ltd

Jueves 19 diciembre 2024

Cantidad : 10000 - Precio : customized

Process capability PCB max. size : 400*310mm PCB min. size: 50*50mm PCB thicknesses: 0.4~6mm Components size: 0201-150mm Min lead pitch: 0.3mm Min BGA ball pitch: 0.4mm Placement precision: +/- 0.03mm Lines : 8 x SMT production lines, 2 x DIP production lines, and 2 assembly...

Jueves 19 diciembre 2024

Cantidad : 10000 - Precio : customized

Process capability PCB max. size : 400*310mm PCB min. size: 50*50mm PCB thicknesses: 0.4~6mm Components size: 0201-150mm Min lead pitch: 0.3mm Min BGA ball pitch: 0.4mm Placement precision: +/- 0.03mm Lines : 8 x SMT production lines, 2 x DIP production lines, and 2 assembly...

Jueves 19 diciembre 2024

Cantidad : 10000 - Precio : customized

Process capability PCB max. size : 400*310mm PCB min. size: 50*50mm PCB thicknesses: 0.4~6mm Components size: 0201-150mm Min lead pitch: 0.3mm Min BGA ball pitch: 0.4mm Placement precision: +/- 0.03mm Lines : 8 x SMT production lines, 2 x DIP production lines, and 2 assembly...

Jueves 19 diciembre 2024

Cantidad : 10000 - Precio : customized

Process capability PCB max. size : 400*310mm PCB min. size: 50*50mm PCB thicknesses: 0.4~6mm Components size: 0201-150mm Min lead pitch: 0.3mm Min BGA ball pitch: 0.4mm Placement precision: +/- 0.03mm Lines : 8 x SMT production lines, 2 x DIP production lines, and 2 assembly...

Jueves 19 diciembre 2024

Cantidad : 10000 - Precio : customized

Process capability PCB max. size : 400*310mm PCB min. size: 50*50mm PCB thicknesses: 0.4~6mm Components size: 0201-150mm Min lead pitch: 0.3mm Min BGA ball pitch: 0.4mm Placement precision: +/- 0.03mm Lines : 8 x SMT production lines, 2 x DIP production lines, and 2 assembly...