Materias primeras

Shenzhen Semshine Tech Co., Ltd

Cantidad : MOQ 1 piec

1 Description PCB Specification
2 Material FR-4/HTG150-180 FR-4/CEM-1/CEM-3/Aluminum
3 Layer 1-20
4 Board Thickness 0.2mm- 4.0mm
5 Board Thickness Tolerance +/-10%
6 Copper thickness 17.5um-175um (0.5oz-5oz)
7 Min Trace Width 0.15mm
8 Min Space Width 0.15mm
9 Min Drilling Dia 0.2mm
10 PTH copper thickness 0.4-2mil(10-50um)
11 Tolerance of Etching ±1mil(±25um)
12 V-cut angle 25°,30°,45°,60°
13 Pearl Strength of line ≥ 6lb/in(≥ 107g/mm)
14 Impedance control and tolerance 50Ω±10%
15 Twist&Wrap ≤ 0.5%
16 Soldermask Green, Red, Blue, White, Black, Yellow
17 Surface Finish/Plating HASL/Lead Free HASL/OSP/Gold Plating/Immersion Gold/ENIG
18 Certificate ROSH. ISO9001,SGS, UL Certificate
19 File Protel 99se/P-CAD/Autocad/Cam350
20 Inner packing Vacuum packing,Plastic bag
21 Outer packing Standard carton packing


Quantity
Ubicación : Room1603, Dongfeng Buliding,No.2010,ShengNanzhong Rd Futian, Shenzhen,China, 518000 Shenzhen,
Persona a contactar : Wendy Wang, 86 755 82771240

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Shenzhen Semshine Tech Co., Ltd

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