Wafer Back Grinding Wheel
Cantidad : 5000-40,00 Precio : USD10-USD2,000/pc
E-Grind Back Grinding wheels have developed the technology to combine diamond and bond to meet your requirements. Especially our advanced porosity technology makes it possible to grind all types of wafers with less bug-surface damage. Our Back-Grinding wheels use a special vitrified bond for rough grinding or a resin bond for fine finishing and improved process accuracy. Our back-grinding wheel features free cutting, excellent wear resistance, and good shape maintainability for long durability.
Performance of Wafer Back Grinding Wheel
Leading technology
Good self-sharpening
No dressing required
High yeild rate of work-piece
Applications of Wafer Back Grinding Wheel
Used for wafer's back thinning in LED and Semiconductor industries.
Specifications of Wafer Grinding Wheel
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Product Specification |
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Available shape |
6A2T |
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Machine |
GALAXY, SPEEDFAM |
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Working Condition |
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Grinding Type |
Wet |
There are many cbn grinding wheel suppliers in China, but we are one of the best choices for you.
If you want to know more kinds of crankshaft grinding wheels, please visit our website.
Persona a contactar : wheel egrind, 0371 68616868
Buen trato: comprar del vendedor
Por favor, lea nuestras condiciones de uso. También puede visitar nuestras preguntas frecuentes y ver nuestra información sobre los riesgos relacionados con la falsificación.
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Esta página es acerca de los importadores y exportadores de Wafer Back Grinding Wheel Buscar en la categoria : B2B Servicios Buscar en la categoria : grinding, wafer, back, wheel |
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